Author/Authors :
Helfen، نويسنده , , L. and Myagotin، نويسنده , , A. and Pernot، نويسنده , , P. and DiMichiel، نويسنده , , M. and Mikulيk، نويسنده , , P. and Berthold، نويسنده , , A. and Baumbach، نويسنده , , T.، نويسنده ,
Abstract :
Synchrotron-radiation imaging was applied to the non-destructive testing of detector devices during their development cycle. Transmission imaging known as computed laminography was used to examine the microstructure of the interconnections in order to investigate the perfection of technological steps necessary for hybrid detector production. A characterisation of the solder bump microstructure can reveal production flaws such as missing or misaligned bumps, voids in bumps or bridges and thus give valuable information about the bonding process.
