Title of article
Analysis of the production of ATLAS indium bonded pixel modules
Author/Authors
Alimonti، نويسنده , , G. and Andreazza، نويسنده , , A. and Bulgheroni، نويسنده , , A. and Corda، نويسنده , , G. and Di Gioia، نويسنده , , S. and Fiorello، نويسنده , , A. and Gemme، نويسنده , , C. and Koziel، نويسنده , , M. and Manca، نويسنده , , F. and Meroni، نويسنده , , C. and Nechaeva، نويسنده , , P. and Paoloni، نويسنده , , A. and Rossi، نويسنده , , L. and Rovani، نويسنده , , A. and Ruscino، نويسنده , , E.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
7
From page
296
To page
302
Abstract
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions.
Keywords
Stripping , Pixel detector , Indium bump
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
2006
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2201273
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