Author/Authors :
Airoldi، نويسنده , , A. and Alimonti، نويسنده , , G. and Amati، نويسنده , , Amy M. and Andreazza، نويسنده , , A. and Bulgheroni، نويسنده , , A. and Caccia، نويسنده , , M. and Giugni، نويسنده , , D. and Kucewicz، نويسنده , , W. and Lari، نويسنده , , T. and Meroni، نويسنده , , C. and Ragusa، نويسنده , , F. and Troncon، نويسنده , , C. and Vegni، نويسنده , , G.، نويسنده ,
Abstract :
Yield maximization in multichip hybrid pixel sensors is a crucial issue in large volume productions planned for future High-Energy Physics experiments. Bump bonding process optimization can guarantee statistical single bump failure rates at the acceptable level of 10–100 ppm; nevertheless, systematic effects connected to process repeatability can affect the functionality of a full chip in a module to a much larger extent. Because of this, the reversibility of the bonding procedure has been investigated. A feasibility study on single chip assemblies for the ATLAS experiment has been successfully completed, proving the possibility of reworking. As a result of it, a dedicated facility has been conceptually designed, engineered and commissioned. The characteristics of the facility in terms of motion, temperature and tensile strength control are outlined, together with the main results.
