Front-End electronics and integration of ATLAS pixel modules

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 e− within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 million channels of the Pixel detector. For the integration of the 50 μm pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production.