Fabrication of thin self-supporting platinum targets using evaporation techniques

Thin self-supporting isotopic platinum (Pt) targets of 130–200 μg/cm2 thickness have been prepared by evaporation technique, using selective etching and parting reagent methods. The evaporation yield of the selective etching method was higher in comparison to the parting reagent method. Further, the purity of targets formed has been accessed by the Energy Dispersive X-ray Fluorescence (EDXRF) and Elastic Recoil Detection Analysis (ERDA) techniques. The analysis indicated that the targets prepared by the selective etching method contain 2 wt% of Cu. Contamination of C was found to be 2.5 wt% in the targets prepared by both of these methods.