Title of article
Effect of fabrication on high cycle fatigue properties of copper thin films
Author/Authors
Park، نويسنده , , Jun-Hyub Park، نويسنده , , Joong-Hyok and Kim، نويسنده , , Yun-Jae and Choi، نويسنده , , Hyeon-Chang، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2008
Pages
9
From page
318
To page
326
Abstract
The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using the test machine developed by authors. Youngʹs moduli (72, 71 and 69 GPa, respectively) are lower than the literature values (108–145 GPa), while the yield strengths were as high as 358, 350 and 346 MPa, respectively and the ultimate strengths as 462, 456 and 446 MPa, respectively. There is not much difference in the tensile properties of the 3 kinds of films. There is little difference in the fatigue properties of the 3 kinds of films but one of them has shorter fatigue life than others in high cycle region and longer fatigue life than others in low cycle region.
Keywords
Copper , Thin film , high cycle fatigue test , mechanical properties
Journal title
Acta Mechanica Solida Sinica
Serial Year
2008
Journal title
Acta Mechanica Solida Sinica
Record number
2227785
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