Title of article
On the Youngʹs modulus of 304 L stainless steel thin films
Author/Authors
Boubeker، نويسنده , , M. Talea، نويسنده , , M and Goudeau، نويسنده , , Ph and Coupeau، نويسنده , , C and Grilhe، نويسنده , , J، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2000
Pages
5
From page
33
To page
37
Abstract
The sputter-deposited 304-L stainless steel (SS) films on bulk substrates (glass, silicon, steel) generally present large residual stresses that cause debonding of the film from the substrate (stress relaxation) when the film thickness exceeds 500 nm. Although this phenomenon is undesirable for future technological applications, one may take benefit of it for intrinsic mechanical property characterization of the film. In that way, the buckling geometry analysis allows determination of the Youngʹs modulus of the film when the in-plane residual stress is known.
s paper, we applied, with success, this method to extract the Youngʹs modulus of 600-nm thick 304 L SS films. The value obtained indicates a decrease of 30% of the film modulus with respect to bulk steel.
Keywords
Youngיs modulus , Stainless steel thin films , Residual stresses , Debonding , atomic force microscopy
Journal title
Materials Characterization
Serial Year
2000
Journal title
Materials Characterization
Record number
2265827
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