Applicability of dynamic mechanical analysis for CMP polyurethane pad studies

Dynamic mechanical analysis (DMA) was used to obtain dynamic moduli of a standard industrial polishing pad before and after chemical–mechanical polishing (CMP). The multiple transitions found in the tan δ curve of the stacked pad are associated with the components present in the stacked pad. The effective dynamic storage modulus of an IC1000/Suba IV stacked pad showed a correlation with the elasticity of the individual pad materials. These dynamic studies provide evidence that in situ mechanical modifications play a greater role in pad material degradation than those due to chemical modifications.