Title of article :
Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning
Author/Authors :
Sidhu، نويسنده , , R.S and Chawla، نويسنده , , N، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
6
From page :
225
To page :
230
Journal title :
Materials Characterization
Serial Year :
2004
Journal title :
Materials Characterization
Record number :
2266090
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=2266090
