Title of article
Part II: Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding of 6-mil-diameter wire
Author/Authors
Murali، نويسنده , , S. G. Srikanth، نويسنده , , N. and Vath III، نويسنده , , Charles J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
3
From page
93
To page
95
Journal title
Materials Characterization
Serial Year
2005
Journal title
Materials Characterization
Record number
2266125
Link To Document