Title of article
Investigation of Substrate Finishing Conditions to Improve Adhesive Strength of DLC Films
Author/Authors
Ohmori، نويسنده , , H. and Katahira، نويسنده , , K. and Komotori، نويسنده , , Robert J. and Mizutani، نويسنده , , M. and Maehama، نويسنده , , F. and Iwaki، نويسنده , , M.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
4
From page
511
To page
514
Abstract
This study investigated the effects of grinding wheels on the surface modification properties in Electrolytic In-process Dressing grinding. Three specimens were ground with different abrasive grinding wheels: diamond wheel, SiO2 wheel, and diamond + SiO2 wheel. These three different grinding wheels produced surfaces modified by the diffusion of the abrasive elements. Adhesive strength evaluation tests between the substrate surface and the DLC film were performed using micro-scratch testing. The finished surface ground by the diamond + SiO2 wheel showed the highest adhesive strength due to the physical and chemical properties of the diffused elements. As a result, application of this proposed grinding method to mold fabrication shows considerable promise.
Keywords
Coating , Electrical Grinding , Finishing process
Journal title
CIRP Annals - Manufacturing Technology
Serial Year
2005
Journal title
CIRP Annals - Manufacturing Technology
Record number
2267322
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