Microstructural developments in TLP bonds using thin interlayers based on Ni–B coatings

Oxide dispersion strengthened alloy MA 758 was transient liquid phase (TLP) bonded using thin interlayers based on Ni–B electrodeposited coatings and the microstructural developments across the joint region were studied. The bonding surfaces were electrodeposited with a coat thickness of 2–9 μm and microstructural features were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. The homogeneity of the joint was assessed performing micro-hardness test. The results showed that the coating thickness as well as the amount of melting point depressants (boron) in the coatings had a significant effect on the microstructural developments within the joint region. TLP bonds made using a 2 μm thick coating interlayer produced a joint with no visible precipitate formation and parent metal dissolution, and the absence of precipitates was attributed to the lower volume concentration of boron in the 2 μm thick coating interlayer.