• Title of article

    Dynamic Phenomena at Mode-I Crack Front in Silicon Simulated by Extended Molecular Dynamics

  • Author/Authors

    Inamura، نويسنده , , T. and Takezawa، نويسنده , , N. and Shibuya، نويسنده , , K. and Yamada، نويسنده , , K.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2007
  • Pages
    4
  • From page
    561
  • To page
    564
  • Abstract
    Analytical-solution-controlled molecular dynamics that can simulate atomic-scale phenomena around a crack front has been extended so that it can also simulate phenomena caused dynamically by elastic/plastic waves. The result of the simulation for monocrystalline silicon shows that a quasi-statically opening crack creates voids around the crack front and leaves dimples on the fractured surfaces as in cases of ductile fracture. On the other hand, elastic/plastic waves emitted from around the crack front change the above phenomena such that various surfaces, from smooth to very rough ones, result. A smooth surface is created by a Rayleigh wave that travels along fractured surfaces, creating new surfaces at its wavefront, while a rough surface is made by a chain mechanism wherein a void is created by wave-driven cross slip and this void, in turn, emits new waves which cause voids.
  • Keywords
    Simulation , Microdynamics , brittle fracture
  • Journal title
    CIRP Annals - Manufacturing Technology
  • Serial Year
    2007
  • Journal title
    CIRP Annals - Manufacturing Technology
  • Record number

    2267891