Surface analysis of the chemical polishing process using a fullerenol slurry by Raman spectroscopy under surface plasmon excitation

In Cu-CMP using a fullerenol slurry, effective planarization in terms of high removal rate has been confirmed. The high chemical reactivity of fullerenol is suggested to be an essential factor for copper material removal. In situ surface analysis based on the SERS method was performed to reveal the role of the copper–fullerenol interaction in the chemical reaction process during Cu-CMP. A series of SERS Raman spectra suggested that a reacted thin film formed on the copper surface, which was measured using a custom-built measurement system.