Numerical prediction of thermomechanical field localization in orthogonal cutting

Using a complete 2D adaptive numerical methodology together with fully coupled 3D advanced thermo-elasto-viscoplastic-damage constitutive equations; this paper focusses on the spatial localization of the main thermomechanical fields under dynamic loading conditions with high strain rates, high temperature and large inelastic strains. First, the advanced fully coupled and time dependent (i.e. thermo-elasto-viscoplastic) constitutive equations accounting for mixed nonlinear isotropic and kinematic hardening and ductile isotropic damage are presented. The associated numerical aspects are then briefly discussed in the framework of fully adaptive 2D finite element analysis. The thermomechanical fields’ localization is examined through the typical example of orthogonal cutting. Attention is paid to the localization of the main thermomechanical fields inside intensive shear bands as well as to the macroscopic crack paths through the chip thickness leading to the chip segmentation.