• Title of article

    Mechanical properties of experimental dental composites containing a combination of mesoporous and nonporous spherical silica as fillers

  • Author/Authors

    Samuel، نويسنده , , Solomon Praveen and Li، نويسنده , , Shuxi and Mukherjee، نويسنده , , Indraneil and Guo، نويسنده , , Yi and Patel، نويسنده , , Alpa C. and Baran، نويسنده , , George and Wei، نويسنده , , Yen، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2009
  • Pages
    6
  • From page
    296
  • To page
    301
  • Abstract
    Objectives rous fillers have been investigated for use in dental composites because of their potential for creating micromechanical filler/resin matrix interphase bonding. Such a micromechanical bonding could eliminate the need for the silane treatment of fillers for interfacial chemical bonding that is prone to hydrolysis in the oral environment. In the case of micromechanical bonding, dental polymer chains are threaded mechanically (like a “necklace”) through nanosized channels in the fillers. s ination of mesoporous silica, which was synthesized using the non-surfactant templating method, and nonporous spherical silica (500 nm) was used to prepare experimental dental composites. The porous silica used in this study contained interconnected pores and channels as opposed to porous fillers containing surface pores. The compressive strength, compressive modulus, flexural modulus, and flexural strength of these composites were evaluated. s sults showed that composites containing a combination of mesoporous and nonporous fillers have better mechanical properties than the composites having either of these fillers alone. icance sults showed that a combination of mesoporous and nonporous materials can be used to prepare stronger dental materials that may resist hydrolysis and wear.
  • Keywords
    Non-surfactant Template , Mesoporous fillers , Dental composite , Micromechanical interphase bonding
  • Journal title
    Defence Technology
  • Serial Year
    2009
  • Journal title
    Defence Technology
  • Record number

    2316986