Title of article :
Curing efficiency of four self-etching, self-adhesive resin cements
Author/Authors :
Vrochari، نويسنده , , Areti D. and Eliades، نويسنده , , George and Hellwig، نويسنده , , Elmar and Wrbas، نويسنده , , Karl-Thomas، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
5
From page :
1104
To page :
1108
Abstract :
Objectives luate the degree of cure (%DC) of four self-etching, self-adhesive resin cements, and one conventional resin cement, in their self- and dual-curing mode. s lf-etching, self-adhesive resin cements studied were RelyX™ Unicem (3M™ ESPE™ AG), Maxcem™ (Kerr Corporation), Biscem™ (Bisco, Inc.) and Multilink® Sprint (Ivoclar Vivadent® AG) and the classic resin cement was Multilink® Automix (Ivoclar Vivadent® AG). Twelve specimens of each material (1.8 mm × 4 mm × 4 mm) were prepared in room temperature (23 ± 1) °C following the manufacturers’ instructions. Six of them were treated as dual-cured, thus irradiated for 20 s with a halogen light curing unit and left undisturbed for 5 min. The other six were treated as self-cured and were not irradiated, but left in dark and dry conditions for 10 min. The assessment of the %DC was made using micro-ATR FTIR spectrometry. s C in their self-curing mode was very low (10.82–24.93%), with Multilink Sprint exhibiting the highest values among the five. In the dual-curing mode the values obtained were also low (26.40–41.52%), with the exception of Multilink Automix (61.36%). Maxcem was found to have the lowest DC. icance w %DC found raises questions as to whether these materials can be successfully used in clinical applications, where light attenuation takes place. Increased irradiation times could potentially lead to higher %DC, in applications where light is not completely blocked by the overlying restoration.
Keywords :
Self-etching , Resin cement , Dual-set materials , Degree of conversion , Self-adhesive resin cement
Journal title :
Dental Materials
Serial Year :
2009
Journal title :
Dental Materials
Record number :
2317237
Link To Document :
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