Title of article :
Relationship between microtensile bond strength and submicron hiatus at the composite–dentin interface using CLSM visualization technique
Author/Authors :
Ding، نويسنده , , Paul G.F. and Matzer، نويسنده , , Axel R.A.H. and Wolff، نويسنده , , Diana and Mente، نويسنده , , Johannes and Pioch، نويسنده , , Thomas and Staehle، نويسنده , , Hans Jِrg and Dannewitz، نويسنده , , Bettina، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Abstract :
Objectives
cron hiatus” represents a potential space between the base of the collagenous network and the mineralized dentin when it is acid etched for bonding. This study evaluated the relationship between microtensile bond strength (μTBS) and occurrence of submicron hiatus formations at the resin–dentin interface using the same specimens.
s
dentin bonded micro-specimens (sticks with a size of 300 μm × 300 μm × 8 mm) were prepared using one of two material combinations (group I: Syntac Classic/Tetric Ceram Cavifil: n = 51 group II: Prime & Bond NT/Tetric Ceram Cavifil: n = 56). After labeling the primer component with a tiny amount of rhodamine-B-isothiocyanate, submicron hiatus formations were imaged nondestructively using a confocal laser scanning microscope (CLSM). Subsequently specimens were subjected to a μTBS test.
s
e influence of submicron hiatus formations on μTBS with the Syntac Classic group, the nonparametric Spearmanʹs correlation was −0.329 at p = 0.02. For the Prime & Bond NT group, the nonparametric Spearmanʹs correlation was −0.356 at p = 0.007. Analyzing the effect of submicron hiatus on without discriminating by group resulted in a Spearmanʹs correlation coefficient of −0.341 at p = 0.001; μTBS and quality of hybrid layer showed a correlation coefficient of 0.849 at p = 0.001, and μTBS and quality of tag formation showed a correlation coefficient of 0.474 at p = 0.001.
icance
gree of submicron hiatus formations had an influence on microtensile bond strength for both the Syntac Classic and the Prime & Bond NT group.
Keywords :
Bonding interface , Submicron hiatus , Microtensile bond strength , Adhesion , Dentin , Resin
Journal title :
Dental Materials
Journal title :
Dental Materials