Silicon doped carbon/Cu joints based on amorphous alloy brazing for first wall application

Amorphous ribbon-type filler-metals represent a promising selection for joining heterogeneous materials together. In this work, rapidly solidified ribbon-type Ti based amorphous filler with a melting temperature of 850 °C and a thickness up to 20 μm is used to join silicon doped carbon to pure copper. SEM examinations demonstrate that a high quality brazed joints could be acquired. The brazed seam has a uniform structure and pore free along its entire length. TiC and ZrC are formed near the interface of carbon and filler-metal when the brazing holds enough time. Using very thin Mo and Cu foil (0.2 mm in thickness) as multiple interlayer are very effective to mitigate the thermal stress occurred in the interface between carbon and copper. The shear strength of this carbon–multiple interlayer–copper joint is more than 20 MPa, and the rupture is mainly occurred on the carbon side.