Author/Authors :
Taherkhani, A. Central Tehran Branch - Department of Materials Engineering - Islamic Azad University, Tehran, Iran , Shajari, Y. Institute of Materials and Energy, Meshkin Dasht, Karaj, Iran , Mirzavand, K. Department of Metallurgy and Materials Engineering - Imam Khomeini International University, Qazvin, Iran , Mellatkhah, A. Department of Metallurgy and Materials Engineering - Ferdowsi University of Mashhad, Mashhad, Iran , Seyedraoufi, Z. S. Department of Materials Engineering - Islamic Azad University, Karaj, Iran
Abstract :
In the present study, the effect of electroplating time on the intensity of flow and the constant potential difference on the
thickness of the coating, surface smoothness, microstructure of the interface between substrate and coating and hardness of
coating were investigated. Microstructural studies by optical microscopy (OM) showed that increasing the electroplating
time leads to increase the coating thickness. Investigations showed that increasing the plating time due to growth leads to
increase the surface roughness of coating. In the middle part of the coating, by increasing the time of plating, the thickness of
eutectic Ag-Cu film increased. The results of microhardness of coatings showed that the maximum hardness was achieved at
the highest planting time i.e 8 minutes. The microhardness remained at a constant range for about half a minute to two
minutes, but increasing the time to 4 and 8 minutes leads to increase toughness of 107 and 131 Hv.
Keywords :
Silver Coating , Electroplating Time , Coating Thickness , Microhardness
