Title of article :
Effect of silver interlayer on transient liquid phase (TLP) bonding of Al 2024 to Ti-6Al-4V joints
Author/Authors :
Farshbaf, M Department of Petroleum - Mining and Material Engineering - Central Tehran Branch - Islamic Azad University, Tehran , Mofid, M. A Department of Petroleum - Mining and Material Engineering - Central Tehran Branch - Islamic Azad University, Tehran , Hajian Heidary, M Department of Materials science and Metallurgy - Shahrood University of technology, Shahrood , Naeimian, H Department of Petroleum - Mining and Material Engineering - Central Tehran Branch - Islamic Azad University, Tehran
Abstract :
Transient liquid phase (TLP) bonding of two dissimilar alloys Al 2024 and Ti-6Al-4V was carried out at 580 and 600 °C for 45 min
bonding time using a 30-µm-thick pure silver (Ag) foil interlayer.
Scanning electron microscopy (SEM) and X-ray diffraction (XRD)
were used to investigate the phase structure and compositional
changes across the joint region. Mechanical properties of the joints
were investigated through shear strength and hardness tests. The
joint formation was due to the solid-state diffusion of Ag and Cu into
Al and Ti alloys, followed by eutectic formation, isothermal
solidification, and formation of various intermetallic compounds
such as Ag2Al, Al2Cu and Al2CuMg along the Ag/Al2024 interface.
Moreover, the interdiffusion of titanium and aluminum led to the
formation of Al3Ti intermetallic compounds. These types of
intermetallics produced a metallurgical bond at Al 2024 interface.
The study showed that the shear strength of the joint reaches a high
value of 176.11 MPa obtained at the higher bonding temperature of
600 °C. It was also observed that the sample failed away from the base metal.
Keywords :
Transient liquid phase , Aluminum , Silver foil , Shear strength , Bonding temperature
Journal title :
Journal of Advanced Materials and Processing
