Title of article :
Physicochemical and organoleptic properties of cookies incorporated with legume flour
Author/Authors :
Noor Aziah, A. A. Universiti Sains Malaysia - School of Industrial Technology - Food Technology Division, Malaysia , Mohamad Noor, A. Y. Universiti Sains Malaysia - School of Industrial Technology - Food Technology Division, Malaysia , Ho, L.H. Universiti Sains Malaysia - School of Industrial Technology - Food Technology Division, Malaysia
From page :
1539
To page :
1543
Abstract :
This study was to investigate the effects of wheat flour substitution with legume flour (mung bean and chick pea) in cookies in terms of the physicochemical and organoleptic properties. Three formulations of cookies were prepared from (a) Control (100% wheat flour), (b) Mung bean (50% wheat flour + 35% mung bean flour + 15% corn flour) and (c) Chickpea (50% wheat flour + 35% chickpea flour + 15% corn flour). The physicochemical and organoleptic attributes of the three types of cookie were evaluated. Results showed significant different (p 0.05) in terms of ash, protein, crude fibre and total carbohydrate among cookies. Chickpea cookies was significantly (p 0.05) highest in protein and resistant starch content among the three types of cookies. The mung bean cookies was significantly (p 0.05) highest in weight, diameter, height and spread ratio. Textural measurement showed chickpeas cookies was significantly highest (p 0.05) in hardness, crispiness, elasticity, gumminess, and chewiness than the other two types of samples evaluated. For sensory evaluation, chickpeas cookies showed significant high difference in flavor , crispiness and aftertaste attributes but insignificant (p 0.05) different between mungbean cookies in term of overall acceptability. Chickpea cookies had the best flavour , crispiness and acceptability .
Keywords :
Mung bean flour , cookies , chickpea , legume , resistant starch
Journal title :
International Food Research Journal
Journal title :
International Food Research Journal
Record number :
2560292
Link To Document :
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