Dough mixing and thermal properties including the pasting profiles of composite flour blends with added hydrocolloids

Dough mixing and thermal properties including the pasting profiles of various commercial wheat flour (WF)-banana pseudostem flour (BP)-hydrocolloid blends were determined using a farinograph, differential scanning calorimetry (DSC) and a rapid-visco analyser (RVA). The prepared blends were WF, WF substituted with 10% BP (10BP) and 10BP with added 0.8% w/w (flour weight basis) xanthan gum (XG) or sodium carboxymethylcellulose (CMC) (10BPX and 10BPC, respectively). The dough of 10BP and the doughs containing XG or CMC reduced stability and breakdown time compared with the WF dough. All doughs containing BP demonstrated greater water absorption and mixing tolerance index values than the WF dough. The substitution of 10% BP into WF and the addition of hydrocolloids did not significantly affect the conclusion temperature (Tc) of the mixture, but did increased the onset temperature (To), peak temperature (Tp) and decreased the gelatinisation enthalpy change (ΔHg) of the blends. Samples of 10BP, 10BPX and 10BPC significantly decreased (p 0.05) the breakdown, final viscosity and setback of the mixtures. These are vital characteristics to understand prior to the development of new formulation for low-calorie, wheat-based products.