Optimization of Electronic Boards Equipped with the BGA Package to Improve the Response in Random Vibration

A wide range of electronic components are affected by dynamic loading during its lifetime mostly included variable frequencies and amplitude called random vibration. In order to evaluate the life cycle and endurance resistance of such components, fatigue analysis under different working condition is necessary. An effective solution for improving life cycle of the components could be making the natural frequencies of the components far away from the range of loading frequencies in random loading. In this paper a printed circuit board (PCB) with two BGA electronic components has been considered in order to optimize natural frequency. The PCB simulated using ABAQUS FEM software and published experimental test has been used for validation of results. The optimization has been performed by two different algorithms including GA and a DOE based RSM. The obtained responses have been compared and validated.