Title of article :
Thermo-mechanical and Light Transmittance of Silica Diffusant Filled Epoxy Composites
Author/Authors :
Chin, Lim Wei Universiti Sains Malaysia, Engineering Campus - School of Materials and Mineral Resources Engineering, Malaysia , Hung, Huong Ling Bayan Lepas Industrial Estate, Malaysia , Shyang, Chow Wen Universiti Sains Malaysia, Engineering Campus - School of Materials and Mineral Resources Engineering, Malaysia
From page :
93
To page :
107
Abstract :
Epoxy ternary blends (DCN) were prepared by mixing diglycidyl ether bisphenol A (DGEBA), cycloaliphatic epoxy, and novolac epoxy. The silica diffusants were prepared by the addition of spherical silica (SS) into epoxy blends. The thermal properties of the epoxy composites were characterised using a thermo-mechanical analyser (TMA), a differential scanning calorimeter (DSC), and a dynamic mechanical analyser (DMA). It was found that the storage modulus of the epoxy was increased in the presence of SS diffusants. However, the coefficient of thermal expansion (CTE) and the glass transition temperature (Tg) of the epoxy ternary blends was reduced by the addition of SS diffusants, which was because the expansion of the epoxy matrix was constrained in the presence of silica fillers. The UV/Vis spectroscopy results demonstrated that the percentage of transmittance of epoxy was decreased by the incorporation of the silica diffusant.
Keywords :
polymer composites , thermal properties , light , emitting diodes (LED) , epoxy blends , silica
Journal title :
Journal of Physical Science
Journal title :
Journal of Physical Science
Record number :
2581531
Link To Document :
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