Title of article :
Physical Properties and Precipitate Microstructures of Cu-HfAlloys at Different Processing Stages
Author/Authors :
Wei, Haigen National Engineering Research Centre for Copper Smelting and Manufacturing - Institute of Engineering Research - Ganzhou - Jiangxi 341000, China , Li, Mingmao National Engineering Research Centre for Copper Smelting and Manufacturing - Institute of Engineering Research - Ganzhou - Jiangxi 341000, China , Wang, Hang National Engineering Research Centre for Copper Smelting and Manufacturing - Institute of Engineering Research - Ganzhou - Jiangxi 341000, China , Zhang, Leqing School of Materials Science and Engineering - Jiangxi University of Science and Technology - Ganzhou - Jiangxi 341000, China , Zhu, Mingbiao School of Materials Science and Engineering - Jiangxi University of Science and Technology - Ganzhou - Jiangxi 341000, China
Abstract :
ThemicrostructuralevolutionandhardnessandphysicalpropertiesofaCu-Hfalloyatthedifferentprocessingstageswereinvestigatedusinghardness,conductivityandtensilemeasurements,metallographicmicroscopy,scanningelectronmicroscopy,andtransmissionelectronmicroscopy.Theresultsrevealthattheelectricalconductivityofthesealloyswasabove80%IACSafteragingat450°C,andthehardnessandconductivityoftheCu-0.9Hfalloywere180HV0.5and80%IACS,respectively.ThesofteningtemperatureoftheCu-0.15Hfalloyis525°C,andthesofteningtemperatureofCu-0.4HfandCu-0.9Hfalloysis550°C.TheprecipitatedHf-containingphaseexhibitedashortrod-likestructure,thesizeofwhichincreasedwithagingtimeataslowrateandresultedinthesizeof~20nmafteragingat450°Cfor300min.
Keywords :
Physical Properties , Precipitate Microstructures , Cu-HfAlloys , Different Processing Stages , IACS
