Title of article :
A study of underfill morphology and filler content using scanning electron microscopy and thermogravimetric analyzer
Author/Authors :
AHMAD, I. Universiti Kebangsaan Malaysia - Faculty of Engineering, Malaysia , ENDUT, Z. Universiti Kebangsaan Malaysia - Faculty of Engineering, Malaysia , ZAHARIM, A. Universiti Kebangsaan Malaysia - Faculty of Engineering, Malaysia , SUKEMI, NORAZHAM MOHD Freescale Semiconductor, (M) Sdn. Bhd., No.2, Malaysia
Abstract :
The filler content of two type capillary underfill materials for flip chip packaging were studied using Thermogravimetric Analyzer (TGA) and Scanning Electron Microscopy (SEM). An epoxy based resin and cyanate ester based resin were sUbjected to TGA to determine the percentage of filler content and theirs morphology were studied using SEM. The results show that these two underfills materials have a very similar percentage of filler content which is around 70% and shows good morphology propeliies for capillary underfill application.
Keywords :
Flip chip , underfill , filler content , morphology , SEM , TGA
Journal title :
Journal of Sustainability Science and Management
Journal title :
Journal of Sustainability Science and Management
