Stress concentration analysis in functionally graded plates with elliptic holes under biaxial loadings

Stress concentration factors (SCFs) at the root of an elliptic hole in unidirectional functionally graded material (UDFGM) plates under uniaxial and biaxial loads are predicted. ANSYS Parametric Design Language (APDL) was used to build the finite element models for the plates and to run the analysis. A parametric study is performed for several geometric and material parameters such as the elliptic hole major axis to plate width ratio, the elliptical shape factor, the gradation direction of UDFGM. It is shown that, SCF in the finite plate can be significantly reduced by choosing the proper distribution of the functionally graded materials. The present study may provide designers an efficient way to estimate the hole effect on plate structures made of functionally graded materials.