Title of article :
Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations
Author/Authors :
Cemal Basaran and Rumpa Chandaroy، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Pages :
27
From page :
601
To page :
627
Keywords :
Electronic packing , solder joint , Vibration
Journal title :
Applied Mathematical Modelling
Serial Year :
1998
Journal title :
Applied Mathematical Modelling
Record number :
295562
Link To Document :
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