Title of article :
Properties of Direct Aluminium Bonded Substrates for Power Semiconductor Components
Author/Authors :
A. Lindemann and G. Strauch، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Keywords :
powersemiconductor devices , direct copper bonded (DCB) substrates , Ceramic insulators , direct aluminum bonded(DAB) substrates , Reliability.
Journal title :
IEEE TRANSACTIONS ON POWER ELECTRONICS
Journal title :
IEEE TRANSACTIONS ON POWER ELECTRONICS
