Title of article
High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications
Author/Authors
J. Yin، نويسنده , , Z. Z. Liang ، نويسنده , , and J. D. van Wyk، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
7
From page
392
To page
398
Keywords
Coefficient of thermal expansion (CTE) , embeddedchip module (ECM).
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Serial Year
2007
Journal title
IEEE TRANSACTIONS ON POWER ELECTRONICS
Record number
341019
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