Title of article :
Investigation of Analytical Solutions for Bonded Structures by Photomechanical Methods
Author/Authors :
W.-C. Wang and J.-S. Hsu، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Pages :
10
From page :
107
To page :
116
Keywords :
Photoelasticity , Thermal stresses , bonded structures , Moire´ interferometry , Finite element method , Lateral displacement
Journal title :
Strain
Serial Year :
2006
Journal title :
Strain
Record number :
343033
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=343033
