Title of article :
Thermal-mechanical interface crack behaviour of a surface mount solder joint
Author/Authors :
C. M. L. Wu، نويسنده , , J. K. L. Lai، نويسنده , , Yong-li Wu، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Pages :
12
From page :
19
To page :
30
Keywords :
Finite element analysis , Lead?tin solder joint , Interface crack , Thermal-mechanical analysis , J-integral
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year :
1998
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number :
351132
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=351132
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