Title of article :
Process capability study and thermal fatigue life prediction of ceramic BGA solder joints
Author/Authors :
D. J. Xie، نويسنده , , Z. P. Wang and G. X. Chen ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Pages :
15
From page :
31
To page :
45
Keywords :
Solder joints , FEM , BGA , Process capability , fatigue life prediction
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year :
1998
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number :
351133
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=351133
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