Title of article
A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies
Author/Authors
Farhad Sarvar، نويسنده , , Paul P. Conway، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1998
Pages
17
From page
47
To page
63
Keywords
PCA , simulation , Re?ow Soldering , thermal
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
1998
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351134
Link To Document