مرکز منطقه ای اطلاع رساني علوم و فناوري - Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

Title of article :

Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

Author/Authors :

Sung Yi، نويسنده , , Kam Yim Sze، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 1998

Pages :

From page :

To page :

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Serial Year :

1998

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Record number :

351135

Link To Document :