Title of article :
Failure modes and FEM analysis of power electronic packaging
Author/Authors :
Hua Ye، نويسنده , , Minghui Lin، نويسنده , , Cemal Basaran and Rumpa Chandaroy، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Keywords :
Electronic packaging , Power electronic packaging , Failure modes , Finite element analysis , Reliability , IGBT
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
