Title of article
Failure modes and FEM analysis of power electronic packaging
Author/Authors
Hua Ye، نويسنده , , Minghui Lin، نويسنده , , Cemal Basaran and Rumpa Chandaroy، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
12
From page
601
To page
612
Keywords
Electronic packaging , Power electronic packaging , Failure modes , Finite element analysis , Reliability , IGBT
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
2001
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351320
Link To Document