Title of article
Integrated design method for flip chip CSP with electrical, thermal and thermo-mechanical qualifications
Author/Authors
De-Shin Liu، نويسنده , , Chin-Yu Ni، نويسنده , , Ching-Yang Chen، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
17
From page
661
To page
677
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
2002
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351391
Link To Document