مرکز منطقه ای اطلاع رساني علوم و فناوري - Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method

Title of article :

Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method

Author/Authors :

D. S. Liu، نويسنده , , Y. C. Chao، نويسنده , , C. H. Wang، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2003

Pages :

From page :

263

To page :

286

Keywords :

Wirebond , Gold wire , Heat a5ected zone , Loop pro le

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Serial Year :

2003

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Record number :

351433

Link To Document :