Title of article :
A hybrid 3D thermo-elastic infinite element modeling for area-array package solder joints
Author/Authors :
D. S. Liu، نويسنده , , D. Y. Chiou، نويسنده , , C. H. Lin، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Keywords :
In nite element , In nite element method , Solder joints , MCM BGA assembly , IE–FE coupling method
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
