مرکز منطقه ای اطلاع رساني علوم و فناوري - Creep flow, diffusion, and electromigration in small scale interconnects

Title of article :

Creep flow, diffusion, and electromigration in small scale interconnects

Author/Authors :

Dongchoul Kim ، نويسنده , , Wei Lu، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2006

Pages :

From page :

2554

To page :

2568

Keywords :

Creep , Nanostructure , Phase field model , Electromigration

Journal title :

Journal of the Mechanics and Physics of Solids

Serial Year :

2006

Journal title :

Journal of the Mechanics and Physics of Solids

Record number :

354987

Link To Document :