Title of article :
THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS
Author/Authors :
Bongtae Han ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
31
From page :
583
To page :
613
Keywords :
far infrared Fizeau interferometry , interconnections , microelectronicspackaging , microscopic moire´ interferometry , Moire´ interferometry , photomechanicsmethods , Shadow moire´ , Twyman=Green interferometry
Journal title :
Journal of Thermal Stresses
Serial Year :
2003
Journal title :
Journal of Thermal Stresses
Record number :
355462
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=355462
