Title of article
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Author/Authors
N. Hasebe ، نويسنده , , X. Wang and M. Okumura ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
12
From page
287
To page
298
Keywords
biomaterial , Half-plane , Interface crack , Stress intensity factor , Energy release rate , Debonding
Journal title
Mechanics of Composite Materials
Serial Year
2004
Journal title
Mechanics of Composite Materials
Record number
356203
Link To Document