مرکز منطقه ای اطلاع رساني علوم و فناوري - Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications

Title of article :

Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications

Author/Authors :

D. G. Ivey، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 1998

Pages :

From page :

281

To page :

287

Keywords :

Solder , coevaporation , InP , electron microscopy. , Au/Sn

Journal title :

Micron

Serial Year :

1998

Journal title :

Micron

Record number :

356740

Link To Document :