Title of article
Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications
Author/Authors
D. G. Ivey، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1998
Pages
7
From page
281
To page
287
Keywords
Solder , coevaporation , InP , electron microscopy. , Au/Sn
Journal title
Micron
Serial Year
1998
Journal title
Micron
Record number
356740
Link To Document