Title of article :
Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines
Author/Authors :
Kabirkumar Mirpuri ، نويسنده , , Jerzy Szpunar، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Keywords :
Orientation imaging microscopy , Interconnects , SCANNING ELECTRON MICROSCOPY
