Title of article
ANALYSIS OF FAILURE MECHANISMS IN THE INTERCONNECT LINES OF MICROELECTRONIC CIRCUITS
Author/Authors
Bower ، نويسنده , , Craft، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1998
Pages
20
From page
611
To page
630
Keywords
Diffusion • Electromigration • Finite elements • Grain boundary • Surface
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Serial Year
1998
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Record number
359151
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