Title of article :
ANALYSIS OF FAILURE MECHANISMS IN THE INTERCONNECT LINES OF MICROELECTRONIC CIRCUITS
Author/Authors :
Bower ، نويسنده , , Craft، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Keywords :
Diffusion • Electromigration • Finite elements • Grain boundary • Surface
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
