Title of article
A modified mixed-mode bending specimen for the interfacial fracture testing of dissimilar materials
Author/Authors
W. O. Soboyejo، نويسنده , , G.-Y. Lu، نويسنده , , S. Chengalva، نويسنده , , J. Zhang ، نويسنده , , V. Kenner، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
12
From page
799
To page
810
Keywords
copper/moulding compound , electronic packages. , dissimilar mixed-mode bending specimen , fracturetoughness , interfacial cracks
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Serial Year
1999
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Record number
359296
Link To Document