Title of article :
Fracture of a ductile layer constrained by stiff substrates
Author/Authors :
S.-H. Choi، نويسنده , , B.-G. Song، نويسنده , , K.-J. Kang ، نويسنده , , N. A. Fleck، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Keywords :
Ductile fracture , Interface fracture , Mixed-mode loading , sandwichspecimen , solder joint
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Journal title :
Fatigue and Fracture of Engineering Materials and Structures