Title of article
Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder
Author/Authors
T. YAMAMOTO، نويسنده , , M. IWATA، نويسنده , , M. SAKANE، نويسنده , , Y. TSUKADA، نويسنده , , H. Nishimura، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
11
From page
376
To page
386
Keywords
lead-free solder , Life prediction , Creep-fatigue , Sn–8Zn–3Bi. , effect of strain waveform
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Serial Year
2007
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Record number
360037
Link To Document