Title of article
Low-cycle fatigue properties of eutectic solders at high temperatures
Author/Authors
YOSHIHARU KARIYA، نويسنده , , TADATOMO SUGA، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
7
From page
413
To page
419
Keywords
Creep , low-cycle fatigue , lead-free solder , Sn–57Bi , grain boundary sliding , miniature testing. , Sn–3.0Ag–0.5Cu , Sn–37Pb
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Serial Year
2007
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Record number
360040
Link To Document