مرکز منطقه ای اطلاع رساني علوم و فناوري - Low-cycle fatigue properties of eutectic solders at high temperatures

Title of article :

Low-cycle fatigue properties of eutectic solders at high temperatures

Author/Authors :

YOSHIHARU KARIYA، نويسنده , , TADATOMO SUGA، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2007

Pages :

From page :

413

To page :

419

Keywords :

Creep , low-cycle fatigue , lead-free solder , Sn–57Bi , grain boundary sliding , miniature testing. , Sn–3.0Ag–0.5Cu , Sn–37Pb

Journal title :

Fatigue and Fracture of Engineering Materials and Structures

Serial Year :

2007

Journal title :

Fatigue and Fracture of Engineering Materials and Structures

Record number :

360040

Link To Document :